Logo LastStep white, European Project
Mid-infrared detection with SiGeSn alloys

LASTSTEP : group-IV LASer and deTectors on Si-TEchnology Platform

Photonics components that emit and detect in the mid-infrared frequency range, also known as the molecular fingerprint region, are key to applications in environmental sensing, food monitoring and biomedical diagnostics. These photonics components are difficult and expensive to manufacture, as they are typically not compatible with conventional, low-cost complementary metal-oxide-semiconductor (CMOS) manufacturing processes. 

The EU-funded LASTSTEP project will overcome this problem using silicon-germanium-tin semiconductors that feature unique optical properties and compatibility with state-of-the-art CMOS manufacturing processes. This could lead to the world’s first monolithic all-Group-IV photonic platform, cost-effective and ready for widespread adoption.

An alliance of 10 organizations

An European Collaboration

A highly skilled consortium of both academic and industry partners have been setup across Europe to cover the entire value chain.

Objectives : Pioneering All-Group-IV Photonic Integration for MIR Applications

LastStep’s vision is to provide the world-first all-Group-IV photonic platform using silicon-germanium-tin alloys (SiGeSn). Such a platform enables light sources (LEDs/laser arrays) in the MIR based on the direct bandgap configuration offered by the GeSn alloy, broadband photodetectors and avalanche photodiodes (APDs).

Rapid Detection of Trace Compounds

2 Markets targeted for LastStep Sensors

LASTSTEP focuses exclusively on the MIR region of 2-5 µm, and in particular on 3.3 µm. The project offers a fully monolithic solutions with CMOS compatible processes. The project adresses optical sensors  detecting chemical species in gas and in liquid, for example discriminating tampered oils and measuring methane concentration. 

Our approach enables cost effective solutions for sensing, but also for the following types of applications :

2 Markets for Future LastStep Sensors : CH4
Recent blog posts​

Our News

LastStep project at the Peter Grünberg Institute Day
Investigation of the use of UV-nanosecond laser annealing (UV-NLA) to obtain more stable Ni(GeSn) alloys than with conventional rapid thermal annealing (RTA) : https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10175097&tag=1
Recent jobs offert

Our Jobs

A position is offered at C2N to work on the development and analysis of electro-optical structure based on GeSn alloys for IR laser devices
A three-year position is offered at CEA to work on mid-infrared sources and detectors for GeSn photonic circuits integrated on silicon for environmental detection.